Bambu PC
SKU: C00-C1-1.75-1000-SPL
VENDOR: Bambu Lab
Pickup available at 7A Kent Street, Yarraville, VIC.
Usually ready in 4 hours if in stock
Bambu PC
Transparent
7A Kent Street, Yarraville, VIC
7A Kent Street
Yarraville VIC 3013
Australia
03 9687 8638
Product Features
- Exceptional Thermal Resistance
- Excellent Mechanical Properties
- High Impact Strength and Durability
- Suitable for Engineering Purpose
- Comes with High Temperature Reusable Spool
- Diameter: 1.75mm +/- 0.03mm
- AMS Compatible
- Enclosure Printers Required
- Dry out before use
Bambu PC
Bambu PC is a filament known for its exceptional strength, dimensional stability, and clarity. Ideal for functional parts and prototypes that require a balance of toughness and visual appeal.
Parameters Comparison
ABS |
ASA |
PC |
|
| Composition | acrylonitrile - butadiene - styrene | acrylonitrile - styrene - acrylate | Polycarbonate |
| Hotend Compatibility | All Size/Material | ||
| Build Plate Compatibility | Engineering Plate, High Temperature Plate, Textuerd PEI Plate | ||
| AMS Compatibility | Yes | Yes | Yes |
| Glue | Bambu Liqud Glue/Glue Stick | Bambu Liqud Glue/Glue Stick | Glue Stick |
| Dry Out Before Use | Recommended | Recommended | Required |
| Odor During Printing | Pungent odor | Relatively lighter pungent odor | Light phenol-flavored odor |
| Toughness (Impact Strength - XY) | 39.3 kJ/m² | 41.0 kJ/m² | 34.8 kJ/m² |
| Strength (Bending Strength - XY) | 62 MPa | 65 MPa | 108 MPa |
| Stiffness (Bending Modulus - XY) | 1880 MPa | 1920 MPa | 2310 MPa |
| Layer Adhesion (Impact Strength - Z) | 7.4 kJ/m² | 4.9 kJ/m² | 9.0 kJ/m² |
| Heat Resistant（HDT, 0.45 MPa） | 87 ℃ | 100 ℃ | 117 ℃ |
| Saturated Water Absorption Rate / % (25 °C，55% RH) | 0.65% | 0.45% | 0.25% |
RFID for Intelligent Printing
All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System). Load and print! No more tedious setting steps.
Accessory Compatibility
Recommended |
Not Recommended |
|
| Build Plate | Engineering Plate, High Temperature Plate or Textured PEI Plate | Cool Plate |
| Hotend | All Size / Material | / |
| Glue | Glue Stick | Bambu Liquid Glue |
Recommended Printing Settings |
Physical Properties |
Mechanical Properties |
|||||
| Drying Settings (Blast Drying Oven) | 80 °C，8 h | Density | 1.20 g/cm³ | Tensile Strength | 55 ± 4 MPa | ||
| Printing and Keeping Container's Humidity | < 20% RH (Sealed, with Desiccant) | Vicat Softening Temperature | 119 °C | Breaking Elongation Rate | 3.8 ± 0.3 % | ||
| Nozzle Temperature | 260 - 280 °C | Heat Deflection Temperature | 117 °C | Bending Modulus | 2310 ± 70 MPa | ||
| Bed Temperature (with Glue) | 90 - 110 °C | Melting Temperature | 228 °C | Bending Strength | 108 ± 4 MPa | ||
| Printing Speed | < 300 mm/s | Melt Index | 32.2 ± 2.9 g/10 min | Impact Strength | 34.8 ± 2.1 kJ/m² | ||
Downloads
Printing Tips
Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.
• Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed. For more details please refer to: Filament drying cover on WIKI.
What's in the Box:
 |
 |
 |
|
Filament x1 & Desicant |
Package x1 |
Filament Label x1 |
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